Our client is hiring a highly motivated and self-driven semiconductor packaging technology expert at Maryland location. This is an exciting opportunity that will broaden and enhance one’s skill and challenge the candidate throughout their career. This opportunity is for those who are technically focused and thrive on solving complex challenges and cooperating in global teams to create future technology platforms and intellectual property.
The successful candidate will have the opportunity to:
- Work with fellow technologists, customers, business unit representatives, sales, reliability, and other teams on a global basis to develop and qualify an assembly roadmap for the future analog and mixed signal products which meets the cost, performance, manufacturing, timeline and reliability goals.
- Organize efficient development methodologies to address issues and lead technology development through cross functional teams.
- Understand detailed customer requirements and verify latest technologies meet or exceed all expectations.
- Publish progress reports to executives and peers on monthly and quarterly basis.
Qualifications
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- MS degree in Engineering, Physics, Chemistry, Industrial or Materials Science. Ph.D. degree is a plus.
- 10+ years’ experience in semiconductor processing or similar industry.
- Knowledge of post fab processing such as wafer thinning, sputter, plating, photolithography, wafer bonding, bumping, wafer level packaging and package assembly.
- Proficiency with optimization of packaging solutions for cost, performance and reliability.
- Experience with wirebond and flip chip interconnect like Cu Pillar bump in package is an asset.
- Experience with MCM and chiplets is an asset.
- Knowledge of automotive reliability requirements is an asset.
- Innovative and creative in finding solutions to problems.
- Strong communication skills and leadership skills.
- Self-motivated and results oriented.
- Comfortable in a team environment.
- Autonomous with minimal supervision when required.
- Eager to work in a highly competitive field and a multicultural environment.
- Job requirements are broad; the candidate must be able to expand and grow in multiple disciplines if not already proficient in those areas (manufacturing/quality, materials, electrical, thermal, and mechanical).
Travel, combination of international and domestic, up to 20% is expected.
Our client
is an Equal Opportunity and Affirmative Action employer. The Company maintains policies and practices that are designed to prevent discrimination or harassment against any qualified applicant or employee to the extent prohibited by federal, state and local laws and regulations.